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Technological capacity

Technological process

Technological objective

Technological index

Equipment

Environmental protection

CONTACT US

TEL:(+86)731-82789286

FAX:(+86)731-82858196

ADDRESS:Composite building, Oak Park, high-tech development zone, Yuelu District, Changsha, Hunan province, China 410025

E-MAIL:sales01@grdfpcb.com
sales02@grdfpcb.com
sales03@grdfpcb.com

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layer

2-18 layer

Max process size

700mm*1100mm

Board thickness

Double-sided board

0.2mm-6.0mm

4-layer board

0.4mm-8.0mm

6-layer board

0.8mm-8.0mm

8-layer board

1.0mm-8.0mm

1-layer board

1.2mm-8.0mm

12-layer board

1.5mm-8.0mm

Copper thickness

0.5oz--13oz

Min line width/space

3mil/3mil

Finished min hole diameter

0.15mm

Aspect ratio

12:1

Impedance control

+/-10%

Surface finish

HASLENIGplug gold-platedimmersion tinimmersion silverOSPspray pure tin

base material

FR4(S1130/S1141/S1170),Tg130℃/Tg170℃,Rogers,Berquist,thermagon,(taconic)

The capacity of double-sided board

60000/year

The capacity of multilayer board

100000/year

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