01

02

03

Technological capacity

Technological process

Technological objective

Technological index

Equipment

Environmental protection

CONTACT US

TEL:(+86)731-82789286

FAX:(+86)731-82858196

ADDRESS:Composite building, Oak Park, high-tech development zone, Yuelu District, Changsha, Hunan province, China 410025

E-MAIL:sales01@grdfpcb.com
sales02@grdfpcb.com
sales03@grdfpcb.com

Home > About us > Technological index

Items

Parameters

Remarks

min line width

3/4

3mil line width allowed in part of the area.

  min line space

3/4    4/5

4mil line space allowed in part of the area

min pad ring

hole size: 3Mil

Clearance refers to the  distance from the side of the hole to the outside pad ring.

 

device hole7Mil

min hole diameter

Board Thickness< 2.0mm

0.2mm

Finished hole

Board Thickness2.0mm

Thickness diameter8

Finished hole

max

board thickness

sigle/double-sided board

3.0mm

0

multi-layer board

6.0mm

min board thickness

 sigle/double-sided board

0.2mm

multi-layer board

4layers:0.4 layers mm6 layers:0.6mm8 layers:1.0mm10 layers:1.2mm

 max panel size

sigle/double-sided board

640 x1100mm

multi-layer board

640 x1100mm

the distance from the line to the board edge

miling outline:0.20mm

V-CUT: 0.4mm

max layer count

24 layers

solder mask

green oil opening(Mil)

2/4

1. refers to the unilateral2..2mi l

allowed in order to keep the green oil bridge and the line from expoursing

green oil birdge(Mil)

6

 refers to the distance between IC tube feet

colour

whitebalckbluegreenyellowred etc

0

legend

min line width

5/8

colour

whiteyellowblack etc

surface plating

HASLplating Enig/goldImm. Enig/gold etc

plating layer thicknessmicroinch

process

plating type

min thickness

 max thickness

panel plating

Enig-layer thickness

Min thickness100

150

gold-layer thickness

1

3

imm.Enig

Enig-layer thickness

100

Copyright (C) OAK Cream Co., Ltd. ︱ICP:10013861   Technical support:info center HOME | ABOUT US | NEWS | PRODUCTS | TECHNOLOGY | QUALITY | CONTACT US